Features

• World’s first eco-friendly RGB gaming memory module
• Exclusive heat dissipating coating delivers overclocking with peace of mind
• Eco-friendly IMR friendly process enhances green gaming aesthetics
• Industry leading 60% Illuminated RGB area
• Create Personalized Lightshow with XPG Prime
• PMIC for power supply stability
• On-die ECC error correction
• Supports Intel® XMP 3.0 and AMD EXPO for easy overclocking

The LANCER BLADE RGB adopts a low-profile heatsink design, removing height consideration from heatsink assembly, and making the product suitable for installation in small chassis. The heatsink is decorated in simple geometric lines, which are a versatile look when paired with various chassis types. The LANCER BLADE RGB has undergone strict component selection and screening procedures, and passed reliability and compatibility tests. It is strong and durable, offering the highest quality! Users can use RGB software provided by major motherboard manufacturers or use XPG PRIME lighting effect software to freely control RGB effects and link all supported products for a customized light show. The LANCER BLADE RGB supports AMD EXPO and is compatible with the latest AMD platform. It also supports Intel XMP 3.0 overclocking, providing players with excellent overclocking performance.

Compact Low-Profile Heatsink Design

The LANCER BLADE RGB boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interfering with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.

RGB Your Way

Set the RGB lighting the way you want it. Choose from different effects (static, breathing, and comet) or sync the lights with your favorite jams via Music Mode. All this can be done through RGB control software from all the major motherboard brands.

What’s in the box:-

1x Kingston RAM DIMM DDR4 Non-ECC Memory

DESCRIPTION:-

This document describes ValueRAM’s KVR26N19S6/4 as a 512M

x 64-bit (8GB) DDR4-2666 CL19 SDRAM (Synchronous DRAM),

1Rx16, memory module, based on four 512M x 16-bit FBGA

components. The SPD is programmed to JEDEC standard

latency DDR4-2666 timing of 19-19-19 at 1.2V. Each 288-pin

DIMM uses gold contact fingers. The electrical and mechanical

specifications are as follows:

FEATURES:-

• Power Supply: VDD = 1.2V Typical

• VDDQ = 1.2V Typical

• VPP = 2.5V Typical

• VDDSPD = 2.2V to 3.6V

• Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

• Low-power auto self-refresh (LPASR)

• Data bus inversion (DBI) for data bus

• On-die VREFDQ generation and calibration

• Single-rank

• On-board I2 serial presence-detect (SPD) EEPROM

• 8 internal banks; 2 groups of 4 banks each

• Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

• Selectable BC4 or BL8 on-the-fly (OTF)

• Fly-by topology

• Terminated control command and address bus

• PCB: Height 1.23” (31.25mm)

• RoHS Compliant and Halogen-Free

SPECIFICATIONS :-

CL(IDD) : 19 cycles

Row Cycle Time (tRCmin) : 45.75ns(min.)

Refresh to Active/Refresh

Command Time (tRFCmin) : 350ns(min.)

Row Active Time (tRASmin) : 32ns(min.)

Maximum Operating Power : TBD W*

UL Rating : 94 V – 0

Operating Temperature : 0o C to +85o C

Storage Temperature : -55o C to +100o C

*Power will vary depending on the SDRAM used